If all goes well, innovations in the design of faster memory, CPUs, and GPUs, along with ultra-compact PC assembly, will soon become commonplace.

PC hardware is an ever-evolving field. From CPUs and GPUs to storage speeds, memory, and power standards, we have witnessed the transformation of PC components into the high-performance devices they are today. Whether it's the debate between DDR4 and DDR5 RAM or considering an upgrade to PCIe 5.0 SSDs, it can be said that PC users are always excited to try the next big thing in PC hardware.

Notable developments are brewing behind the scenes for CPUs, GPUs, RAM, SSDs, motherboards, cases, and more.

GDDR7 in Next-Generation GPUs

You may be familiar with GDDR6 or GDDR6X, which are the current standards for graphics memory or VRAM used in graphics cards. Companies like Samsung and Micron have indicated that the next step for high-performance graphics memory has arrived. Although Samsung announced the completion of GDDR7 memory development last year, the official news was only released earlier this year.

Reports suggest that the latest VRAM standard will increase memory speeds by 42% compared to GDDR6X—equipping next-generation GPUs with 32Gbps and 28Gbps memory. It is rumored that Nvidia's RTX 5000 series graphics cards will use GDDR7 memory, so we might see high-end SKUs like the RTX 5090 and RTX 5080 with memory speeds of 32Gbps and bandwidths up to 1.5Tbps (compared to 1.1Tbps with GDDR6).Samsung and Micron are very likely to improve and increase the speed of GDDR7 memory over time. GDDR6 did just that, launching at a speed of 14Gbps and later increasing to 24Gbps. As a result, we might even see 36Gbps or 37Gbps VRAM in the next generation of graphics cards. Another positive development of this new memory standard could be at least 16GB VRAM on each next-generation GPU.

New CPUs and GPUs with multi-chip designs

The multi-chip design using "chiplets" is nothing new in PC hardware. Since the Zen 2 series, AMD has been using a chiplet-based design in its CPUs, with a computing chip and I/O chip on each processor. By shifting from a monolithic chip configuration to this chiplet design, manufacturers can greatly improve performance, reduce cache latency, and simplify the memory subsystem.

Intel's next-generation Arrow Lake CPU and Nvidia's RTX 5000 series GPU may adopt a similar approach. Intel has already transformed its Meteor Lake mobile chip with separate computing, graphics, I/O, and SoC chips. But this is the first time Intel is bringing this innovative design to desktop end-users, allowing the company to customize the various components of its processors individually, rather than redesigning a monolithic chip with each generation.

There are even rumors that Nvidia is also using a multi-chip module (MCM) approach in its RTX 5000 series GPUs, which would allow it to achieve better specifications without increasing chip size. Although this MCM-based design may be limited to the next-generation high-end SKUs, it will gradually become popular in mid-range and even budget SKUs in subsequent iterations.

3D stacked cache in Intel CPUs

AMD's 3D V-Cache technology has made its Ryzen X3D series processors the top of the game rankings, surpassing the best gaming CPUs from itself and competitors like Intel. But this technology is not exclusive to AMD—it is actually implemented by TSMC's manufacturing process. It turns out that Intel has long planned to introduce a similar 3D stacked cache in its own CPUs, providing gamers with another option to achieve the best gaming performance.

CEO Pat Gelsinger said that Intel may take a slightly different approach, using 3D stacking in its chip architecture to meet the needs of end-users and data center customers. This technology is not part of Meteor Lake and may not even be launched with the Arrow Lake desktop processors, but Intel may first introduce this technology in the next generation of CPUs.In general, 3D stacking has long been on the radar of chip manufacturers, hence Intel's public plan to eventually adopt the technology in an effort to achieve higher overall performance and compete with AMD in gaming performance. AMD's X3D chips have long been unmatched in gaming performance, so it will be interesting to see what effects Intel's first-generation 3D cache can achieve.

Desktop and Laptop CAMM2 Memory

We are accustomed to using RAM in the form of sticks or DIMM/SODIMM. However, a new innovation by Dell and JEDEC may soon change the appearance and operation of RAM. A new memory standard called CAMM2 (an improvement from CAMM) has already appeared in laptops such as the Lenovo ThinkPad P1 (7th generation) in the form of LPCAMM2 memory. Crucial is even selling LPCAMM2 modules to end users.

CAMM, or "Compressed Attached Memory Module," aims to replace the bulkier DIMM and SODIMM in desktops and laptops, respectively. It will also allow for RAM upgrades in more devices, as manufacturers do not have to solder RAM directly to the motherboard to save space. They can use CAMM2 memory, thereby saving space, achieving upgradability, improving transfer speeds, and enhancing aesthetics.

Companies such as MSI and ASRock have already demonstrated motherboards that support the CAMM2 memory standard, which includes a single CAMM2 slot. Therefore, when upgrading, you may need to replace the entire RAM. But the good news is that CAMM2 will support dual-channel configurations with only a single module. Although desktop products supporting CAMM2 will take some time to hit the market, it seems that an updated and better memory standard is finally here.

Wireless PC Assembly

In the past few months, several PC hardware manufacturers have collaborated to launch wireless motherboards, graphics cards, and cases, aiming to change the appearance of the inside of a PC. Different manufacturers have launched these wireless PC components under different names - MSI's Project Zero, ASUS's Back to the Future, and Gigabyte's Project Stealth.

Although these concepts have existed for several years, it is only recently that they have begun to attract the real attention of PC users. The price of these wireless versions may be a bit higher than the regular versions, but the price will definitely not be outrageous, allowing PC manufacturers to truly consider adopting a super clean appearance in the next assembly.As more and more component manufacturers join the wireless revolution, the construction of most PCs may start to look quite different from what we are accustomed to. Please note that you will still need cable management, but at least the front of your PC will look cleaner.

Despite the criticism of PC assembly due to high costs or lackluster product launches, there are still some things to look forward to. If all goes well, innovations in faster memory, CPUs, and GPUs with innovative mini-chip designs, as well as ultra-compact PC assembly, may soon become commonplace.

The PC industry is already abuzz with news about new Arrow Lake, Zen 5, and Snapdragon Elite processors, as well as new desktop GPUs from Nvidia, AMD, and Intel.